1.5w/m.k CPU Thermal Conductive Pad

Widely used in Led, DVD, VCD, laptop, computer, power e electronic proudcts etc. Common Specification: 200mm * 400mm, 100*100mm.

1. Description:

Thermal silica sheet is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

2. Features:

1. Insulation, thermal conductivity, wear resistance, flame retardant, filling gaps, resistance to compression, buffering and so on.

2. Products are free to sticky, you can choose different colors

3. Common Specifications: 200mm * 400mm, 100*100mm, 100mm*200mm, 300mm*300mm

4. Non-toxic substances, in line with ROHS requirements

3. How it works:

      1. Transfer the hot heat to the outside interface

      2. In the formation of their electrical insulation layer between the heat interface and electronic components       

     3. Materials, electronic components in the buffer to be subjected to severe shocks to form a protective

4. Applications:

1. UPS power supply, power inverter products, heat module for the different size of power

 2. DVD, VCD and any filling material required

 3. LED with the size of the power, a variety of displays

 4. Electrical and electronic products, control board, motor, the external pad and mats, electronics, auto mechanics, Mainframe computer, laptop.

5. Performance

1.5w/m.k CPU Thermal Conductive Pad